Nordson Electronics Solutions, a global leader in precision electronics manufacturing technologies, is all set to present its latest high-yield semiconductor packaging solutions at SEMICON Taiwan 2025, taking place September 10–12 at booth i2326.
Visitors will experience the ASYMTEK Vantage dispensing system, equipped with dual IntelliJet jet valves for maximum productivity and accuracy in semiconductor packaging and microelectronics assembly. Known for its versatility, the Vantage system supports a wide range of applications including panel-level packaging, wafer-level underfill, gap fill, sealing, and module assembly, delivering consistent performance in high-volume production environments.
Plasma treatment removes impurities and activates surfaces to enhance flow and adhesion for improved semiconductor package reliability. Nordson experts in plasma treatment will be available to discuss how customers can use this technology for successful advanced packaging operations.
The theme for SEMICON Taiwan 2025, “Leading with Collaboration. Innovating with the World,” will showcase how the semiconductor community is navigating supply chain shifts and how the industry is developing solutions for today and the future.
