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    XTRAIA XD-3300: Rigaku’s Breakthrough in Non-Destructive Metrology for 2nm and 3D Chips

    Electronics 30.07.2025

    Rigaku Corporation, a global leader in X-ray metrology systems and a Group company of Rigaku Holdings Corporation (Akishima, Tokyo; CEO: Jun Kawakami), has begun…

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    Electronics

    Infineon Expands SiC Portfolio with High-Performance G2 MOSFETs in Q-DPAK

    Infineon Technologies AG has introduced its next-generation CoolSiC 1200 V…

    Electronics

    Enhancing Automotive Functional Safety: Infineon and UL Solutions Announce Strategic Collaboration

    Infineon Technologies AG has announced a strategic partnership with UL…

    Electronics

    STMicroelectronics Boosts Automotive Sensing Portfolio with Acquisition of NXP’s MEMS Unit

    KYOCERA AVX Expands Industrial Ethernet Portfolio with PoDL-Enabled SPE Connectors

    26.07.2025

    Siemens and UMC Collaborate to Optimize Chip Reliability and Performance Using mPower EM/IR Drop Analysis

    25.07.2025
    Home»Category: "Electronics" (Page 5)
    Electronics

    AWE 2025: MOVA Ignites the Future of Smart Home Technology with Cutting-Edge Innovation

    On March 23rd, AWE 2025 officially concluded. At this grand gathering of global technology and innovation, the high-end smart home appliance brand MOVA made a stunning appearance with twelve pioneering technologies and a full range of new products. Among them, the X40 Pro wet and dry vacuum sets new industry…

    Electronics

    Renesas Introduces Comprehensive Lithium-Ion Battery Management Platform Featuring Pre-Validated Firmware

    Renesas Electronics Corporation, a leading provider of advanced semiconductor solutions, has announced new all-in-one solutions for managing lithium-ion battery packs in various battery-powered consumer products, including e-bikes, vacuum cleaners, robotics, and drones. Equipped with pre-validated firmware, the R-BMS F (Ready Battery Management System with Fixed Firmware) aims to streamline development,…

    Electronics

    Silicon Labs Announces New Series 2 BG29 Family of Wireless SoCs

    Silicon Labs, a leader in low-power wireless technology, has unveiled its new Series 2 BG29 family of wireless SoCs. Designed to deliver high compute power and connectivity in ultra-compact Bluetooth Low Energy (LE) devices, the BG29 sets a new benchmark for performance without compromising size. It is ideal for demanding…

    Electronics

    Rohde & Schwarz unveils new R&S NRP140TWG(N) thermal power sensor: A new benchmark for F band applications

    Rohde & Schwarz presents the new R&S NRP140TWG(N) thermal power sensor, designed to meet the growing demands of applications in the F band utilizing a WR 8 waveguide connector. The NRP140TWG(N) is fully traceable to the National Metrology Institute (NMI) in Germany (PTB) and is temperature compensated, ensuring accurate and…

    Electronics

    Infineon and ARAI collaborate to advance automotive semiconductor solutions

    Infineon Technologies Asia Pacific Pte Ltd and The Automotive Research Association of India (ARAI) have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced semiconductor solutions for the Indian automotive sector. The collaboration will focus on the development of EV inverters and vehicle control units tailored for use in electric…

    Electronics

    JACS Solutions: Celebrating Over Six Years of TAA-Compliant Production in Taiwan

    Leading innovative cellular technology and IoT solutions company, JACS Solutions is thrilled to highlight its continued commitment to Trade Agreements Act (TAA)-compliant production in Taiwan. This strategic investment underscores the company’s resilience and adaptability in the face of an ever-evolving global trade landscape. For more than six years, JACS Solutions has…

    Electronics

    Huawei Introduces its upgraded Fiber to the Office (FTTO) 2.0 solution to Help Campuses Realize Intelligent Transformation

    During MWC 2025, Huawei had launched the upgraded FTTO 2.0 solution, leading the development of 10G campus networks. Perry Yang, President of Huawei Enterprise Optical Domain, said, “For campus networks, Wi-Fi 7 has entered the ramp-up phase, and ‘fiber-in copper-out’ has become the choice of many customers. Up to now,…

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